Removing corporate-specific keying in OshPark template

OshPark-2Layer/OshPark-2Layer.kicad_pcb

@@ -1,4 +1,4 @@
-(kicad_pcb (version 20171130) (host pcbnew "(5.1.2-117-g0ee38653f)")
+(kicad_pcb (version 20171130) (host pcbnew "(5.1.2-201-g3c8f901a1)")
 
   (general
     (thickness 1.6002)
@@ -12,7 +12,6 @@
   (page USLetter)
   (title_block
     (rev 1)
-    (company "Seth Hillbrand / KiCad Services Corp.")
   )
 
   (layers
@@ -60,7 +59,8 @@
     (mod_text_width 0.127)
     (pad_size 1.524 1.524)
     (pad_drill 0.762)
-    (pad_to_mask_clearance 0.0508)
+    (pad_to_mask_clearance 0)
+    (solder_mask_min_width 0.1016)
     (aux_axis_origin 0 0)
     (visible_elements FFFFFF7F)
     (pcbplotparams

OshPark-2Layer/OshPark-2Layer.pro

@@ -1,4 +1,4 @@
-update=Tue 11 Jun 2019 04:50:27 PM PDT
+update=Fri 19 Jul 2019 09:40:17 AM PDT
 version=1
 last_client=kicad
 [general]
@@ -64,15 +64,15 @@ CopperTextThickness=0.3048
 CopperTextItalic=0
 CopperTextUpright=1
 EdgeCutLineWidth=0.03809999999999999
-CourtyardLineWidth=0.03809999999999999
+CourtyardLineWidth=0.05
 OthersLineWidth=0.1524
 OthersTextSizeV=1.016
 OthersTextSizeH=1.016
 OthersTextSizeThickness=0.1524
 OthersTextItalic=0
 OthersTextUpright=1
-SolderMaskClearance=0.0508
-SolderMaskMinWidth=0
+SolderMaskClearance=0
+SolderMaskMinWidth=0.1016
 SolderPasteClearance=0
 SolderPasteRatio=-0
 [pcbnew/Layer.F.Cu]

OshPark-2Layer/OshPark-2Layer.sch

@@ -1,5 +1,6 @@
 EESchema Schematic File Version 4
-EELAYER 29 0
+LIBS:OshPark-2Layer-cache
+EELAYER 30 0
 EELAYER END
 $Descr USLetter 11000 8500
 encoding utf-8
@@ -7,8 +8,8 @@ Sheet 1 1
 Title ""
 Date ""
 Rev "1"
-Comp "Seth Hillbrand / KiCad Services Corp."
-Comment1 ""
+Comp ""
+Comment1 "Designed for OSH Park 2 Layer Prototype"
 Comment2 ""
 Comment3 ""
 Comment4 ""

OshPark-2Layer/fp-info-cache

@@ -0,0 +1 @@
+0