(module "Alchitry_Conn" (layer F.Cu) (tedit 5D30EE76)
  (fp_text reference "B1" (at -0.1929 5.2768) (layer B.SilkS)
    (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
  )
  (fp_text value "Alchitry_Shield" (at 0 5.08) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start -8 3.5) (end 8 3.5) (layer F.CrtYd) (width 0.12))
  (fp_line (start -8 -3.5) (end -8 3.5) (layer F.CrtYd) (width 0.12))
  (fp_line (start 8 -3.5) (end -8 -3.5) (layer F.CrtYd) (width 0.12))
  (fp_line (start 8 3.5) (end 8 -3.5) (layer F.CrtYd) (width 0.12))
  (fp_line (start 6.46 -2) (end 7.58 -2) (layer B.SilkS) (width 0.12))
  (fp_line (start 6.46 2) (end 7.58 2) (layer B.SilkS) (width 0.12))
  (fp_line (start -7.62 2) (end -6.5 2) (layer B.SilkS) (width 0.12))
  (fp_line (start -7.62 -2) (end -6.5 -2) (layer B.SilkS) (width 0.12))
  (fp_line (start 7.58 -2) (end 7.58 2) (layer B.SilkS) (width 0.127))
  (fp_line (start -7.62 -0.8) (end -7.62 -2) (layer B.SilkS) (width 0.127))
  (fp_line (start -7.42 0.8) (end -7.42 -0.8) (layer B.SilkS) (width 0.127))
  (fp_line (start -7.62 -0.8) (end -7.42 -0.8) (layer B.SilkS) (width 0.127))
  (fp_line (start -7.62 0.8) (end -7.62 -0.8) (layer B.SilkS) (width 0.127))
  (fp_line (start -7.42 0.8) (end -7.62 0.8) (layer B.SilkS) (width 0.127))
  (fp_line (start -7.62 2) (end -7.62 0.8) (layer B.SilkS) (width 0.127))
  (pad "B38" smd roundrect (at -0.02 -2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B37" smd roundrect (at 0.48 -2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B1" smd roundrect (at -6.02 2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B2" smd roundrect (at -5.52 2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B7" smd roundrect (at -3.02 2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B8" smd roundrect (at -2.52 2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B34" smd roundrect (at 1.98 -2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B21" smd roundrect (at 3.98 2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B20" smd roundrect (at 3.48 2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B47" smd roundrect (at -4.52 -2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B46" smd roundrect (at -4.02 -2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B45" smd roundrect (at -3.52 -2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B44" smd roundrect (at -3.02 -2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B3" smd roundrect (at -5.02 2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B4" smd roundrect (at -4.52 2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B29" smd roundrect (at 4.48 -2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B30" smd roundrect (at 3.98 -2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B39" smd roundrect (at -0.52 -2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B26" smd roundrect (at 5.98 -2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B27" smd roundrect (at 5.48 -2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B28" smd roundrect (at 4.98 -2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B35" smd roundrect (at 1.48 -2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B17" smd roundrect (at 1.98 2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B16" smd roundrect (at 1.48 2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B49" smd roundrect (at -5.52 -2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B48" smd roundrect (at -5.02 -2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B13" smd roundrect (at -0.02 2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B50" smd roundrect (at -6.02 -2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B19" smd roundrect (at 2.98 2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B18" smd roundrect (at 2.48 2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B36" smd roundrect (at 0.98 -2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B43" smd roundrect (at -2.52 -2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B42" smd roundrect (at -2.02 -2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B5" smd roundrect (at -4.02 2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B6" smd roundrect (at -3.52 2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B23" smd roundrect (at 4.98 2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B22" smd roundrect (at 4.48 2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B9" smd roundrect (at -2.02 2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B10" smd roundrect (at -1.52 2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B31" smd roundrect (at 3.48 -2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B32" smd roundrect (at 2.98 -2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "" np_thru_hole circle (at -6.95 1.25) (size 0.6 0.6) (drill 0.6) (layers *.Cu *.Mask))
  (pad "" np_thru_hole circle (at 6.95 1.25) (size 0.6 0.6) (drill 0.6) (layers *.Cu *.Mask))
  (pad "B41" smd roundrect (at -1.52 -2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B40" smd roundrect (at -1.02 -2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B15" smd roundrect (at 0.98 2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B14" smd roundrect (at 0.48 2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B25" smd roundrect (at 5.98 2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B11" smd roundrect (at -1.02 2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B12" smd roundrect (at -0.52 2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B33" smd roundrect (at 2.48 -2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
  (pad "B24" smd roundrect (at 5.48 2.2 90) (size 2 0.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
    (solder_mask_margin 0.1016))
)